Method and apparatus for determining end point in a polishing pr

Details Method and apparatus for determining end point in a polishing pr Method and apparatus for determining end point in a polishing pr

1999-03-30

2000-06-06

Morgan, Eileen P.

Abrading

Precision device or process - or with condition responsive...

By optical sensor

451 41, 451 10, 451285, 451287, 156345, 438692, 356375, B24B 100

Patent

active

060711779

ABSTRACT:
A method for determining an end point in a chemical mechanical polishing process by utilizing a dual wavelength interference technique and an apparatus for carrying out such method are provided. In the method, a rotating platen that is equipped with a laser generating source capable of generating laser emissions in two different wavelengths is utilized such that a dual wavelength interference pattern may be received by a laser detector and a greatly expanded period between cycles in a resulting dual wavelength interference pattern may be utilized to determine the end point for material removal in a significantly larger thickness of material. The present invention novel method and apparatus can be utilized not only in monitoring the end point of CMP polishing of a thin oxide layer such as ILD or STI, but also in material removal of larger thickness such as in the planarization process of an IMD layer.

REFERENCES:
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5461007 (1995-10-01), Kobayashi
patent: 5643044 (1997-07-01), Lund
patent: 5722875 (1998-03-01), Iwashita et al.
patent: 5872633 (1999-02-01), Holzapfel et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 5899792 (1999-05-01), Yagi
patent: 5910846 (1999-06-01), Sandhu
patent: 5948203 (1999-09-01), Wang
patent: 5949927 (1999-09-01), Tang

Affiliated with

Also associated with

Rating

Method and apparatus for determining end point in a polishing pr does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for determining end point in a polishing pr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for determining end point in a polishing pr will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2209689