Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2006-05-02
2006-05-02
Niebling, John F. (Department: 2812)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
Reexamination Certificate
active
07038481
ABSTRACT:
A method and apparatus for determining burn-in reliability from wafer level burn-in are disclosed. The method according to the present invention includes recording the number of failures in each IC die in nonvolatile elements on-chip at points in time over the duration of wafer level burn-in testing. The number of failures in each IC die, along with their associated points in time, may be used to create burn-in reliability curves which are conventionally derived using other processes that may be less cost effective or not possible to effect with unpackaged IC dice. A memory device associated with the method of the present invention is also disclosed.
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U.S. Appl. No. 09/651,858, filed Aug. 30, 2000.
Micro)n Technology, Inc.
Niebling John F.
Stevenson Andre ′ C.
TraskBritt
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