Method and apparatus for determining and quantifying resistance

Measuring and testing – Coating material: ink adhesive and/or plastic

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73 7, G01N 356

Patent

active

060002840

ABSTRACT:
A method and system (100) for determining and quantifying the resistance to scuff damage of a film (152) adhered to a substrate (150) of a panel (154), is described. The system includes a computer (102), pressure control valves (104) and a test module (10). The test module has an indentor support plate (12) with an indentor (24 or 224), a compression moving plate (14) and an end plate (16). The plates are connected together by rods (18). The indentor support plate and the end plate are mounted at opposite ends of the rods with the compression moving plate mounted therebetween. An actuator (36) having bellows (42) is mounted between the end plate and the compression moving plate. The panel is mounted on a sliding panel support plate (58) which is connected to a load cell (106). In use, the panel support plate and the panel are positioned between the compression moving plate and the indentor support plate so that the indentor is adjacent the film on the substrate. Next, air is provided to the actuator which moves the moving plate toward the indentor support plate and causes the indentor to make contact with the film on the substrate. The panel support plate and the panel are moved down between the plates such that the indentor produces a scuff on the film. The indentation load on the panel is read by the computer from the load cell.

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