Method and apparatus for determining an operation status of...

Details Method and apparatus for determining an operation status of... Method and apparatus for determining an operation status of...

2008-03-11

2008-03-11

Chen, Kin-Chan (Department: 1792)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S714000, C156S345420, C216S058000

Reexamination Certificate

active

11476104

ABSTRACT:
In an operation status determination method for a plasma processing apparatus, a principal component analysis is carried out by using operation status data groups. Processing parameter values in the respective operation status data groups are converted into principal component scores which are plotted in a two-dimensional coordinate system with axes of the selected principal components. A movement vector P from a first recipe operation status data group for reference apparatus to a first recipe operation status data group for target apparatus is calculated. An actually measured normal area A2is set, and a predicted normal area B2is set by moving the area A2along the movement vector P. Then, it is determined whether or not the principal component scores corresponding to the respective processing parameter values when the second recipe is applied to the target apparatus are included in the predicted normal area B2.

REFERENCES:
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patent: 2002/0026251 (2002-02-01), Johnson et al.
patent: 2004/0067645 (2004-04-01), Chen et al.
patent: 2004/0168770 (2004-09-01), Mitrovic et al.
patent: 2005/0004683 (2005-01-01), Yamazaki
patent: 2005/0125090 (2005-06-01), Sakano et al.
patent: 2005/0143952 (2005-06-01), Tomoyasu et al.
patent: 2005/0146709 (2005-07-01), Oh et al.

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