Method and apparatus for determination of the end point in chemi

Details Method and apparatus for determination of the end point in chemi Method and apparatus for determination of the end point in chemi

1996-06-21

1997-09-16

Nguyen, Nam

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Electrical characteristic sensed

216 86, 216 89, 216 88, 451 41, 438 17, 438692, 156345, H01L 2166, H01L 21302

Patent

active

056676298

ABSTRACT:
An apparatus and method for determination of the endpoint for chemical mechanical polishing of a layer of dielectric material formed on an integrated circuit wafer. A first voltage is generated which is proportional to the current supplying electrical power to the electric motor driving the polishing mechanism. The current is proportional to the rate of removal of dielectric material by the polishing process. The integral over time of the first voltage, which is proportional to the amount of dielectric material removed, is generated by an integrator circuit. A comparator circuit compares the integral over time of the first voltage to a reference voltage. The reference voltage is proportional to the initial thickness of the dielectric material and is a function of the age of the polishing pad. When the integral over time of the first voltage is less than the reference voltage the polishing continues. When the integral over time of the first voltage is equal to the reference voltage or becomes larger than the reference voltage the polishing is stopped.

REFERENCES:
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5308438 (1994-05-01), Cote et al.
patent: 5337015 (1994-08-01), Lustig et al.
patent: 5449638 (1995-09-01), Hong et al.
patent: 5492594 (1996-02-01), Burke et al.
patent: 5499733 (1996-03-01), Litvak

Affiliated with

Also associated with

Rating

Method and apparatus for determination of the end point in chemi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for determination of the end point in chemi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for determination of the end point in chemi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-215396