Method and apparatus for detecting wire bond pull test failure m

Details Method and apparatus for detecting wire bond pull test failure m Method and apparatus for detecting wire bond pull test failure m

1992-10-30

1994-01-04

Myracle, Jerry W.

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

324538, G01N 308

Patent

active

052750582

ABSTRACT:
Provided is a method and apparatus for electrically detecting the location of bond failure and wire breakage occurring during tensile strength testing of a wire sample having first and second bond foots affixed to respective first and second support pads. The method and apparatus monitors the voltage levels of first and second electrically conductive probes. The first probe has a primary lead in electrical contact with the first support pad and a secondary lead in electrical contact with the first bond foot. Similarly, the second electrically conductive probe has a primary lead in electrical contact with the second support pad and a secondary lead in electrical contact with the second bond foot. Voltage detection circuitry is provided in electrical contact with the first and second probes for detecting the voltage level at each of the respective primary and secondary leads to generate the respective corresponding output signals. Comparator circuitry is further provided in electrical contact with the voltage detection circuitry for receiving and comparing each of the output signals to a selected reference value and generating a supplemental output signal indicating the location of bond failure or wire breakage.

REFERENCES:
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patent: 3945248 (1976-03-01), West
patent: 4282759 (1981-08-01), Merrell
patent: 4453414 (1984-06-01), Ronemus et al.
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patent: 4895028 (1990-01-01), Mayer
patent: 4907458 (1990-03-01), Biggs et al.
patent: 5214963 (1993-06-01), Widder

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