Method and apparatus for detecting shorts in a multi-layer elect

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – For fault location

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324537, 324754, 438 17, G01R 3128

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active

058217592

ABSTRACT:
A method and apparatus for locating shorts in multi-layer electronic packages during manufacture allows repair of the shorts and improved yields of the packages. A multi-layer package is fitted in a fixture after forming a thin film layer of metalization, and test is performed to detect shorts in the package. If a short is detected, a low current, high frequency signal is injected in pins on a bottom surface of the package. An approximate two dimensional location of the short is sensed by detecting an electromagnetic force induced by a magnetic field inductively coupled to a sensor proximate to the short on a top surface of the multi-layer package. The approximate location of the short is then inspected to precisely locate the short.

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