Method and apparatus for detecting pin-holes in a passivation la

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324450, 324765, 324 711, G01N 2720, G01N 2728, G01R 3112

Patent

active

059630400

ABSTRACT:
The present invention discloses a novel method and apparatus for de-etching pin-holes in a passivation layer that is deposited over a metal conductor layer on the surface of a semiconductor wafer by utilizing a substantially clear, electrically conductive film as a top electrode immersed in an electrolyte for observing under an optical microscope bubbles generated from a pin-hole on the wafer surface which functions as a bottom electrode when a DC current is flowing through the top electrode, the electrolyte and the bottom electrode such that gases in the form of bubbles are generated at the pin-hole site where metal is exposed to the electrolyte.

REFERENCES:
patent: 4103228 (1978-07-01), Ham
patent: 5059913 (1991-10-01), Nigro et al.
patent: 5504017 (1996-04-01), Yue et al.

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