Method and apparatus for detecting leaks in IC packages by sensi

Details Method and apparatus for detecting leaks in IC packages by sensi Method and apparatus for detecting leaks in IC packages by sensi

1988-12-05

1990-01-16

Williams, Hezron E.

Measuring and testing

With fluid pressure

Leakage

G01M 336

Patent

active

048934992

ABSTRACT:
A leak in an enclosure of an integrated circuit package is detected by the steps of: filling the enclosure with a first gas at the time the enclosure is sealed; subsequently enveloping the integrated circuit package with a second gas that is different than the first gas; holding the second gas at a constant pressure over a certain time period; and sensing a surface of the enclosure, during the above steps, for the presence of microscopic deflections. If the enclosure has a gross leak, no deflection will occur when the package is initially enveloped with the second gas. If the package has a minor leak, a deflection will occur when the package is initially enveloped with the second gas, and the amount of the deflection will decrease during the holding time period. Preferably, the second gas is lighter than the first gas so that it diffuses into the cavity faster than the first gas diffuses out of the cavity; and preferably the microscopic deflections of the enclosure are sensed with a mechanical probe in increments of 0.0001 inches.

REFERENCES:
patent: 3559460 (1971-02-01), Orner
patent: 4663964 (1985-05-01), Croce
patent: 4715215 (1987-12-01), Perhach et al.
patent: 4771630 (1988-09-01), Croce et al.

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