Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2005-02-28
2010-10-12
Mariam, Daniel G (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S145000, C382S151000
Reexamination Certificate
active
07813541
ABSTRACT:
A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.
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“Speckle
Dorfan Yuval
Dotan Noam
Sali Erez
Wagner Mark
Yanir Tomer
Applied Materials South East Asia Pte. Ltd.
Mariam Daniel G
Sonnenschein Nath & Rosenthal LLP
Woldemariam Aklilu k
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