Method and apparatus for detecting backside contamination...

Details Method and apparatus for detecting backside contamination... Method and apparatus for detecting backside contamination...

2005-09-13

2005-09-13

Niebling, John F. (Department: 2812)

Semiconductor device manufacturing: process

Making point contact device

C438S014000

Reexamination Certificate

active

06943055

ABSTRACT:
A method of detecting contamination on a backside of a semiconductor wafer includes the steps of positioning the backside of the wafer in contact with a detection surface of a contaminant sensor, and detecting deformation of the detection surface of the contaminant sensor. The contaminant sensor may be incorporated into a fabrication device such as a wafer handling device, or can be utilized in the construction of a stand-alone device. An apparatus for detecting contamination on the backside of a semiconductor wafer is also disclosed.

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