Method and apparatus for detecting a solder bridge in a ball gri

Details Method and apparatus for detecting a solder bridge in a ball gri Method and apparatus for detecting a solder bridge in a ball gri

1998-10-08

1999-09-21

Williams, Hezron

Measuring and testing

Inspecting

738659, G01M 1900

Patent

active

059556838

ABSTRACT:
An assembled printed circuit board (PCB) is inspected. The PCB has a device assembled to the PCB by a ball grid array (BGA). The BGA includes a plurality of rows of solder connections. A filament is directed into a first side of the BGA, between two adjacent rows of solder connections in the BGA, as far as it will go. A solder bridge is detected if the filament does not emerge from a second side of the BGA opposite the first side. An inspection apparatus for performing this inspection includes a plurality of filaments. Each filament is longer than a side of the BGA. Each filament has a diameter or thickness sufficiently small to fit between adjacent rows of solder connections in the BGA; and a fixture for holding the plurality of filaments. The fixture has a pitch between adjacent filaments approximately equal to a pitch between adjacent rows of solder connections in the BGA. The plurality of filaments are simultaneously directed into respective spaces between successive pairs of rows of solder connections in a first side of the BGA as far as possible into the BGA. A solder bridge is detected if any of the plurality of filaments does not emerge from the second side of the BGA.

REFERENCES:
patent: 4686637 (1987-08-01), Linker, Jr. et al.
patent: 4704700 (1987-11-01), Linker et al.
U.S. application No. 09/168,638, Holliday, filed Oct. 8, 1998.

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