Method and apparatus for detecting a crack in a...

Details Method and apparatus for detecting a crack in a... Method and apparatus for detecting a crack in a...

2011-07-05

2011-07-05

Nguyen, Ha Tran T (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07973547

ABSTRACT:
A method for detecting a crack in a semiconductor wafer, which includes an electrical device and a connecting pad electrically coupled with the electrical device, is described. The crack is detected by an acoustic detector being acoustically coupled to the semiconductor wafer during contacting the contacting pad with a probe.

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Tilgner, R., et al., “Changing States of Delamination Between Molding Compound and Chip Surface: A Challenge for Scanning Acoustic Microscopy,” IEEE Transactions on Components and Manufacturing Technology—Part B, Aug. 1994, pp. 442-448, vol. 17, No. 3, IEEE.
“Mechanical Characterization Lab. Nanoindentation—Micro Scratch Test—AFM,” 2006, 6 pages, Divisione FCS, ITC-irst , Via Sommarive 18, 38050, Povo, Trento, Italy, http://fcs.itc.it/labs/indexPLATFORM.asp.

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