Method and apparatus for deposition of solder paste on a printed

Details Method and apparatus for deposition of solder paste on a printed Method and apparatus for deposition of solder paste on a printed

1992-10-23

1993-10-19

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

118258, 118263, 118407, 118413, 427282, C23C 2600

Patent

active

052543625

ABSTRACT:
A method and apparatus for uniformly depositing solder paste on a printed wiring board. A squeegee arrangement applies solder paste through a stencil to a surface of a printed wiring board. As the squeegee assembly is moved in one planar direction over the stencil in a planar fashion, it is also vibrated by a vibrator to produce slight circular motion in addition to the planar motion of the squeegee blade.

REFERENCES:
patent: 3902414 (1975-10-01), Zimmer et al.
patent: 3998158 (1976-12-01), Vertegaal
patent: 4176602 (1979-12-01), Feddersen
patent: 4424718 (1984-01-01), Wadensten
patent: 4604966 (1986-08-01), Kohn
patent: 4622239 (1986-11-01), Schoenthaler
patent: 4720402 (1988-01-01), Wojcik
patent: 4872261 (1989-10-01), Sanyal
patent: 4919970 (1990-04-01), Hoebener
patent: 4961955 (1990-10-01), Goldberg
patent: 4985107 (1991-01-01), Conroy
patent: 5118027 (1992-06-01), Braun

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