Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating electrolytic or nonelectrolytic coating after it is...
Reexamination Certificate
2005-01-04
2005-01-04
McDonald, Rodney G. (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Treating electrolytic or nonelectrolytic coating after it is...
C205S223000, C204S192150, C204S192170, C427S096400, C427S097100, C438S687000
Reexamination Certificate
active
06837979
ABSTRACT:
The present invention provides a method and apparatus for plating a conductive material to a substrate and also modifying the physical properties of a conductive film while the substrate is being plated. The present invention further provides a method and apparatus that plates a conductive material on a workpiece surface in a “proximity” plating manner while a pad type material or other fixed feature is making contact with the workpiece surface in a “cold worked” manner. In this manner, energy stored in the cold worked regions of the plated layer is used to accelerate and enhance micro-structural recovery and growth. Thus, large grain size is obtained in the plated material at a lower annealing temperature and a shorter annealing time.
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Talieh Homayoun
Uzoh Cyprian Emeka
ASM-Nutool Inc.
McDonald Rodney G.
Pillsbury & Winthrop LLP
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