Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2011-05-31
2011-05-31
Nhu, David (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S643000, C257S758000, C257SE21006, C257SE21007, C257SE21077, C257SE21051, C257SE21499
Reexamination Certificate
active
07952193
ABSTRACT:
In one embodiment, the present invention is a method and apparatus for chip cooling. One embodiment of an inventive method for bonding a liquid metal to an interface surface (e.g., a surface of an integrated circuit chip or an opposing surface of a heat sink) includes applying an adhesive to the interface surface. A metal film is then bonded to the adhesive, thereby easily adapting the interface surface for bonding to the liquid metal.
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Furman Bruce K.
Martin Yves C.
van Kessel Theodore G.
International Business Machines - Corporation
Nhu David
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