Method and apparatus for demounting wafers

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

15405, 294264, 134 59, 156584, B32B 3116

Patent

active

044668520

ABSTRACT:
Wafers (12), including those in the solid state electronics industry, are demounted from an adherent surface (79). A respective passageway (90) is extended from a fluid supply device (92), through the adherent surface (79) to and in communication with, the mounting surface (16) of a respective wafer (12). The fluid is applied via the passageway (90) to and between the mounting surface (16) of the wafer (12) and the adherent surface (79) with sufficient pressure to dislodge the wafer (12). In an advantageous embodiment, the passageway (90) extends to a location between about the centerline (98) and the periphery of the wafer (12). The fluid is thereby applied in an off-center manner with leveraged force to break the seal between the adherent surface (79) and the wafer (12).

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patent: 3436789 (1969-04-01), Hays
patent: 3850721 (1974-11-01), Schubert
patent: 3915784 (1975-10-01), Makhijani et al.
patent: 3992236 (1976-11-01), Wanesky
patent: 4104099 (1978-08-01), Scherrer
patent: 4239567 (1980-12-01), Winings
patent: 4283242 (1981-08-01), Regler et al.
patent: 4334945 (1982-06-01), Raush

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