Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1983-10-27
1984-08-21
Dawson, Robert A.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
15405, 294264, 134 59, 156584, B32B 3116
Patent
active
044668520
ABSTRACT:
Wafers (12), including those in the solid state electronics industry, are demounted from an adherent surface (79). A respective passageway (90) is extended from a fluid supply device (92), through the adherent surface (79) to and in communication with, the mounting surface (16) of a respective wafer (12). The fluid is applied via the passageway (90) to and between the mounting surface (16) of the wafer (12) and the adherent surface (79) with sufficient pressure to dislodge the wafer (12). In an advantageous embodiment, the passageway (90) extends to a location between about the centerline (98) and the periphery of the wafer (12). The fluid is thereby applied in an off-center manner with leveraged force to break the seal between the adherent surface (79) and the wafer (12).
REFERENCES:
patent: 2517193 (1950-08-01), Fraser
patent: 3436789 (1969-04-01), Hays
patent: 3850721 (1974-11-01), Schubert
patent: 3915784 (1975-10-01), Makhijani et al.
patent: 3992236 (1976-11-01), Wanesky
patent: 4104099 (1978-08-01), Scherrer
patent: 4239567 (1980-12-01), Winings
patent: 4283242 (1981-08-01), Regler et al.
patent: 4334945 (1982-06-01), Raush
Beltz Richard K.
Large Donald M.
Leffel Daniel D.
AT&T - Technologies, Inc.
Dawson Robert A.
Watson D. C.
LandOfFree
Method and apparatus for demounting wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for demounting wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for demounting wafers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1936929