Method and apparatus for deflashing of integrated circuit...

Electric heating – Metal heating – By arc

Reexamination Certificate

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C219S121670, C219S121760

Reexamination Certificate

active

10902897

ABSTRACT:
This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO2laser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after CO2laser deflashing. CO2laser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.

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patent: WO 00/37209 (2000-06-01), None

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