Method and apparatus for decreasing the time needed to die bond

Details Method and apparatus for decreasing the time needed to die bond Method and apparatus for decreasing the time needed to die bond

1995-08-16

1997-11-25

Sells, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264 69, 29832, B32B 3116

Patent

active

056907664

ABSTRACT:
Disclosed is a die bonding system comprising a conveyor 10, a speaker 12 and a function generator 14. The conveyor 10 carries a leadframe 14 bearing a prescribed quantity of die bonding epoxy 16. At a station situated above the speaker 12, a chip 18 is pressed down with a force F onto the epoxy and leadframe. While this force is being applied, the function generator 14 excites the speaker 12 to generate an acoustic signal sufficient to effect the vibration of the epoxy relative to the leadframe at a frequency of about 250 Hz and an amplitude of approximately 10 to 50 .mu.m, preferably 20 .mu.m. Such a vibration causes the epoxy to flow freely to a thin, uniform thickness, and thus permits the chip to be quickly bonded to the leadframe with a small force.

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