Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2006-11-10
2008-05-27
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S668000
Reexamination Certificate
active
07378723
ABSTRACT:
A method and apparatus for decoupling conductive portions of a microelectronic device package. In one embodiment, the package can include a microelectronic substrate and a conductive member positioned at least proximate to the microelectronic substrate. The conductive member can have first and second neighboring conductive portions with at least a part of the first conductive portions spaced apart from a part of the neighboring second conductive portion to define an intermediate region between the first and second conductive portions. Each conductive portion has a bond region electrically coupled to the microelectronic substrate. A dielectric material is positioned adjacent to the first and second conductive portions in the intermediate region and has a dielectric constant of less than about 3.5.
REFERENCES:
patent: 5062565 (1991-11-01), Wood et al.
patent: 5086018 (1992-02-01), Conru et al.
patent: 5089878 (1992-02-01), Lee
patent: 5145099 (1992-09-01), Wood et al.
patent: 5434357 (1995-07-01), Belcher et al.
patent: 5569625 (1996-10-01), Yoneda et al.
patent: 5654877 (1997-08-01), Burns
patent: 5677566 (1997-10-01), King et al.
patent: 5701035 (1997-12-01), Teraguchi et al.
patent: 5826628 (1998-10-01), Hamilton
patent: 5879965 (1999-03-01), Jiang et al.
patent: 5904500 (1999-05-01), Tay et al.
patent: 5932345 (1999-08-01), Furutani et al.
patent: 5986209 (1999-11-01), Tandy
patent: RE36469 (1999-12-01), Wood et al.
patent: 6013535 (2000-01-01), Moden et al.
patent: 6025728 (2000-02-01), Hembree et al.
patent: 6048744 (2000-04-01), Corisis et al.
patent: 6054754 (2000-04-01), Bissey
patent: 6103547 (2000-08-01), Corisis et al.
patent: 6130474 (2000-10-01), Corisis
patent: 6133068 (2000-10-01), Kinsman
patent: 6133622 (2000-10-01), Corisis et al.
patent: 6148509 (2000-11-01), Schoenfeld et al.
patent: 6150710 (2000-11-01), Corisis
patent: 6153924 (2000-11-01), Kinsman
patent: 6159764 (2000-12-01), Kinsman et al.
patent: 6225689 (2001-05-01), Moden et al.
patent: 6228548 (2001-05-01), King et al.
patent: 6229202 (2001-05-01), Corisis
patent: 6239489 (2001-05-01), Jiang
patent: 6246108 (2001-06-01), Corisis et al.
patent: 6246110 (2001-06-01), Kinsman et al.
patent: 6247629 (2001-06-01), Jacobson et al.
patent: 6258623 (2001-07-01), Moden et al.
patent: 6258624 (2001-07-01), Corisis
patent: 6259153 (2001-07-01), Corisis
patent: 6261865 (2001-07-01), Akram
patent: 6271580 (2001-08-01), Corisis
patent: 6284571 (2001-09-01), Corisis et al.
patent: 6291894 (2001-09-01), Farnworth et al.
patent: 6297547 (2001-10-01), Akram
patent: 6303981 (2001-10-01), Moden
patent: 6303985 (2001-10-01), Larson et al.
patent: 6310390 (2001-10-01), Moden
patent: 6329705 (2001-12-01), Ahmad
patent: 6331448 (2001-12-01), Ahmad
patent: 6335225 (2002-01-01), Doan
patent: 6344976 (2002-02-01), Schoenfeld et al.
patent: 6346152 (2002-02-01), Moden et al.
patent: 2005/0250251 (2005-11-01), Corisis et al.
Definition of “Teflon”, Webster's II New College Dictionary, Houghton Mifflin Company, 1995, p. 1133, ISBN 0-395-70869-9.
TechTarget, “dialectric constant—a whatis definition,” 2 pages. Retrieved from the Internet on Jun. 7, 2002. URL: <http://whatis.techtarget.com/definition/0,,sid9—gci548179,00.html>.
E.I. du Pont de Nemours and Company, “DuPont Flexible Circuit Materials, DuPont™ Pyralux® PC 1000 Flexible Composites,” 5 pages. Retrieved from the Internet on Jun. 12, 2002. URL: <http://www.dupont.com/fcm/products/H-46866.html>.
Micron Technology, Inc., Delivery Specification 511-14-00-0323(07), “Delivery Specification of CEL-9200 MC-U,” 3 pages, Feb. 26, 1997.
Goodfellow Corporation, “Material Information, Polytetrafluoroethylene, PTFE,” 3 pages. Retrieved from the Internet on Nov. 21, 2002. URL: <http://www.goodfellow.com/csp/active/static/A/FP30.HTML>.
Corisis David J.
Schoenfeld Aaron M.
Micro)n Technology, Inc.
Perkins Coie LLP
Potter Roy
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