Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2007-02-27
2007-02-27
Graybill, David E. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S123000, C438S124000, C438S125000, C438S126000
Reexamination Certificate
active
10393376
ABSTRACT:
A method and apparatus for decoupling conductive portions of a microelectronic device package. In one embodiment, the package can include a microelectronic substrate and a conductive member positioned at least proximate to the microelectronic substrate. The conductive member can have first and second neighboring conductive portions with at least a part of the first conductive portions spaced apart from a part of the neighboring second conductive portion to define an intermediate region between the first and second conductive portions. Each conductive portion has a bond region electrically coupled to the microelectronic substrate. A dielectric material is positioned adjacent to the first and second conductive portions in the intermediate region and has a dielectric constant of less than about 3.5.
REFERENCES:
patent: 5062565 (1991-11-01), Wood et al.
patent: 5086018 (1992-02-01), Conru et al.
patent: 5145099 (1992-09-01), Wood et al.
patent: 5434357 (1995-07-01), Belcher et al.
patent: 5569625 (1996-10-01), Yoneda et al.
patent: 5654877 (1997-08-01), Burns
patent: 5677566 (1997-10-01), King et al.
patent: 5701035 (1997-12-01), Teraguchi
patent: 5826628 (1998-10-01), Hamilton
patent: 5879965 (1999-03-01), Jiang et al.
patent: 5904500 (1999-05-01), Tay
patent: 5932345 (1999-08-01), Furutani et al.
patent: 5986209 (1999-11-01), Tandy
patent: RE36469 (1999-12-01), Wood et al.
patent: 6013535 (2000-01-01), Moden et al.
patent: 6025728 (2000-02-01), Hembree et al.
patent: 6048744 (2000-04-01), Corisis et al.
patent: 6103547 (2000-08-01), Corisis et al.
patent: 6130474 (2000-10-01), Corisis
patent: 6133068 (2000-10-01), Kinsman
patent: 6133622 (2000-10-01), Corisis et al.
patent: 6148509 (2000-11-01), Schoenfeld et al.
patent: 6150710 (2000-11-01), Corisis
patent: 6153924 (2000-11-01), Kinsman
patent: 6159764 (2000-12-01), Kinsman et al.
patent: 6225689 (2001-05-01), Moden et al.
patent: 6228548 (2001-05-01), King et al.
patent: 6229202 (2001-05-01), Corisis
patent: 6239489 (2001-05-01), Jiang
patent: 6246108 (2001-06-01), Corisis et al.
patent: 6246110 (2001-06-01), Kinsman et al.
patent: 6247629 (2001-06-01), Jacobson et al.
patent: 6258623 (2001-07-01), Moden et al.
patent: 6258624 (2001-07-01), Corisis
patent: 6259153 (2001-07-01), Corisis
patent: 6261865 (2001-07-01), Akram
patent: 6271580 (2001-08-01), Corisis
patent: 6284571 (2001-09-01), Corisis et al.
patent: 6291894 (2001-09-01), Farnworth et al.
patent: 6297547 (2001-10-01), Akram
patent: 6303981 (2001-10-01), Moden
patent: 6303985 (2001-10-01), Larson et al.
patent: 6310390 (2001-10-01), Moden
patent: 6329705 (2001-12-01), Ahmad
patent: 6331448 (2001-12-01), Ahmad
patent: 6335225 (2002-01-01), Doan
patent: 6344976 (2002-02-01), Schoenfeld et al.
patent: 6346152 (2002-02-01), Moden et al.
Webster's II New College Dictionary, Houghton Mifflin Company, 1995, p. 1133, ISBN 0-395-70869-9.
TechTarget, “dialectric constant—a whatis definition,” 2 pages. Retrieved from the Internet on Jun. 7, 2002. URL: <http://whatis.techtarget.com/definition/0,,sid9—gci548179,00.html>.
E.I. du Pont de Nemours and Company, “DuPont Flexible Circuit Materials, DuPont™ Pyralux® PC 1000 Flexible Composites,” 5 pages. Retrieved from the Internet on Jun. 12, 2002. URL: <http://www.dupont.com/fcm/products/H-46866.html>.
Micron Technology, Inc., Delivery Specification 511-14-00-0323(07), “Delivery Specification of CEL-9200 MC-U,” 3 pages, Feb. 26, 1997.
Goodfellow Corporation, “Material Information, Polytetrafluoroethylene, PTFE,” 3 pages. Retrieved from the Internet on Nov. 21, 2002. URL: <http://www.goodfellow.com/csp/active/static/A/FP30.HTML>.
Corisis David J.
Schoenfeld Aaron M.
Graybill David E.
Micro)n Technology, Inc.
Perkins Coie LLP
LandOfFree
Method and apparatus for decoupling conductive portions of a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for decoupling conductive portions of a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for decoupling conductive portions of a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3865131