Hazardous or toxic waste destruction or containment – Destruction or containment of radioactive waste
Patent
1995-12-19
1997-03-18
Mai, Ngoclan
Hazardous or toxic waste destruction or containment
Destruction or containment of radioactive waste
588233, 588205, 204660, 204665, 205688, G21F 900
Patent
active
056132395
ABSTRACT:
A solution composed of a chelating solution and/or an organic acid is applied to radioactive metals to form a radioactive metal solution. The metal solution is increased in its electrical conductivity by addition of an alkaline agent, followed by electrolysis by an electrolyzer to thereby convert metal ions in the metal solution to hydroxides of low solubility and to separate the hydroxides as a filter cake by subsequent filtration. The filtrate is irradiated with ultraviolet rays for further decomposition of remaining organic matter and then filtered by a device using reverse osmosis. The resultant filtrate is recycled as clean water for use for a chelating solution and electrolytic solution, or is discharged. The metal ions precipitated by treatment with the alkaline agent prior to electrolysis as matter of low solubility is separated from the filtrate which is thereafter electrolyzed.
REFERENCES:
patent: 3890244 (1975-06-01), Carlin
patent: 3932225 (1976-01-01), Bilal et al.
patent: 4056482 (1977-11-01), Schmieder et al.
patent: 5230782 (1993-07-01), Downes, Jr. et al.
patent: 5536389 (1996-07-01), LaNaour et al.
Ichikawa Seigo
Kikuya Akihisa
Obinata Hiroshi
Genden Engineering Services & Construction Co.
Mai Ngoclan
Morikawa Industries Corp.
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