Chemistry: electrical and wave energy – Processes and products – Electrostatic field or electrical discharge
Patent
1989-11-07
1991-06-25
Niebling, John F.
Chemistry: electrical and wave energy
Processes and products
Electrostatic field or electrical discharge
H05F 300
Patent
active
050264648
ABSTRACT:
A halogenated organic compound is introduced into a plasma. In the plasma state, substances are very reactive and chemical substances which are not readily decomposed such as halogenated organic compounds are decomposed in a short time. Specifically, in a high-temperature plasma exceeding 10,000.degree. C., almost all molecules are considered to dissociate into atoms. A reactive substance such as water is introduced into a plasma together with a halogenated organic compound. The decomposed halogenated organic compound is caused to react with the reactive substance, for preventing the decomposed organic compound from returning to its original state.
REFERENCES:
patent: 3723290 (1973-03-01), Hamblyn et al.
patent: 3933608 (1976-01-01), Haas et al.
patent: 4657738 (1987-04-01), Kanter et al.
Chemical Abstract 101:176895p Barton et al.
Chemical Abstract 91:185434q Zimina et al.
"Laboratory Investigation of Thermal Degradation of a Mixture of Hazardous Organic Compounds", John L. Graham; Douglas L. Hall and Barry Dellinger, in Environ. Sci. Technol., vol. 20, No. 7, 1986 pp. 703-710.
Aizawa Reiji
Amano Takanobu
Hirakawa Shoji
Kabayashi Satoru
Koinuma Yutaka
Agency of Industrial Science and Technology
Jeol Ltd.
Marquis Steven P.
Niebling John F.
Yoshida Toyonobu
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