Method and apparatus for decapping integrated circuit packages

Details Method and apparatus for decapping integrated circuit packages Method and apparatus for decapping integrated circuit packages

2005-07-12

2005-07-12

Elve, M. Alexandra (Department: 1725)

Electric heating

Metal heating

By arc

C219S121680

Reexamination Certificate

active

06917011

ABSTRACT:
The invention relates to a method and apparatus for decapping integrated circuit packages. The invention involves irradiating an IC package with laser radiation, typically in the UV-IR spectra and of short pulse duration. The irradiation results in ablation of the molding compound. The invention also provides real-time monitoring and process control of the decapping process and fluid-flow removal of ablation debris. Using the invention, decapping can be performed without causing damage to the internal IC structure. Furthermore, decapping in a liquid can prevent oxidization of the molding compound by ambient air.

REFERENCES:
patent: 5350713 (1994-09-01), Liang
patent: 5367762 (1994-11-01), Disko et al.
patent: 5961860 (1999-10-01), Lu et al.
patent: 6335208 (2002-01-01), Lowry
patent: 6355208 (2002-03-01), Unami et al.
patent: 6518074 (2003-02-01), Nguyen et al.
patent: 451364 (2001-08-01), None
Republic of China Patent Publication No. 451364.

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