Method and apparatus for damping vibrations in a...

Machine element or mechanism – Control lever and linkage systems – Multiple controlling elements for single controlled element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C267S137000, C188S380000, C414S935000, C029S428000

Reexamination Certificate

active

06976400

ABSTRACT:
A method of damping a semiconductor wafer handling arm by attaching a spring and a mass coupled to the spring to form a mass spring system that is tuned to vibrate at a structural resonant frequency of the vibrating wafer handling arm. The spring has temperature insensitive spring characteristics and the mass and spring are constructed of materials that do not outgas or produce contaminants in a semiconductor processing environment. The mass spring system is preferably a cantilever beam spring connected to a high response point on the vibrating arm and oriented to vibrate in a plane perpendicular to the plane of the wafer. The mass is slidably adjustable along the length of the cantilever beam spring to adjust the resonant frequency. Vibration damping of the wafer handling arm is accomplished by the transfer of kinetic energy from the vibrating wafer handling arm to the mass spring system.

REFERENCES:
patent: 2736393 (1956-02-01), O'Connor
patent: 3288419 (1966-11-01), Wallerstein, Jr.
patent: 4322063 (1982-03-01), Fischbeck et al.
patent: 4852848 (1989-08-01), Kucera
patent: 5102289 (1992-04-01), Yokoshima et al.
patent: 6134964 (2000-10-01), Jaenker et al.
patent: 6397988 (2002-06-01), Ptak
patent: 6508343 (2003-01-01), Misaji et al.
patent: 6793050 (2004-09-01), Nylander et al.
patent: 6799940 (2004-10-01), Joe et al.
patent: 6821082 (2004-11-01), McGowan
patent: 59-110938 (1984-06-01), None
patent: 6-91583 (1994-05-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for damping vibrations in a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for damping vibrations in a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for damping vibrations in a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3489713

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.