Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1982-05-20
1985-02-19
Wityshyn, Michael
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
83 16, 83 29, 83 55, 156 732, 156 88, 156251, 1565802, 264 23, B29C 2708, B32B 3118
Patent
active
045003726
ABSTRACT:
A method and an apparatus for cutting woven labels. According to the invention, the woven labels, in the form of a continuous ribbon or the like, are fed step by step towards an ultrasonic wave cutting device, where each label is centered and pressed between a first cutting element defining the outline of the label and a second cutting element, aligned with the first, constituting an ultrasonic wave emitter; an ultrasonic impulse of adequate frequency and intensity, causes the cutting and simultaneous cold welding of the label all around the edges.
REFERENCES:
patent: 2260899 (1941-10-01), Heftler
patent: 3392077 (1968-07-01), Brieske et al.
patent: 3404057 (1968-10-01), Heiart
patent: 3416398 (1968-12-01), Bodine, Jr.
patent: 3562041 (1971-02-01), Robertson
patent: 3939033 (1976-02-01), Grgach et al.
patent: 4069727 (1978-01-01), Sparks et al.
patent: 4157719 (1979-06-01), DeWoskin
patent: 4161420 (1979-07-01), Clarke et al.
patent: 4310978 (1982-01-01), Stern
patent: 4449434 (1984-05-01), Johnson
Textilpraxis International "Ultraschall-Schneidgerat fur Synthetics", Feb. 1970, Konradin-Verlag, Leinfelden-Echterdigen, BRD p. 190.
A. Mion S.p.A. Nastrificio
Wityshyn Michael
LandOfFree
Method and apparatus for cutting woven labels does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for cutting woven labels, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for cutting woven labels will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-611698