Method and apparatus for cutting ultra thin silicon wafers

Details Method and apparatus for cutting ultra thin silicon wafers Method and apparatus for cutting ultra thin silicon wafers

2006-04-11

2006-04-11

Morgan, Eileen P. (Department: 3723)

Abrading

Machine

Endless band tool

C125S016020, C125S021000, C451S304000

Reexamination Certificate

active

07025665

ABSTRACT:
A wire saw and wafer stabilizing system are provided for holding wafer sections invariantly against vibration and unwanted movement during the sawing process. A stabilizing means is applied to the ends of partially defined wafer sections at an early stage when the wafer sections are partially cut through a silicon ingot or block of silicon material. The stabilizing means serves to stabilize the wafer sections immovably against vibration, oscillation, or unwanted contact during the subsequent sawing process. The stabilizing system also accelerates handling of the wafers after slicing is completed, facilitates the cleaning process, and allows for more rapid or automated placement of the wafers in cassettes. Wafers produced by the stabilizing system are characterized by a minimized total thickness variation, substantially uniform planarity, and substantially without bow or warp.

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