Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2005-09-06
2005-09-06
Nguyen, George (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S006000, C451S008000, C451S009000, C125S013010, C083S062000, C083S062100
Reexamination Certificate
active
06939199
ABSTRACT:
Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.
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Chua Tan Kok
Chuan Tan Hock
Chye Chew Beng
Har Lim Guek
Peng Neo Chee
Micro)n Technology, Inc.
Nguyen George
Perkins Coie LLP
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