Method and apparatus for cutting grooves into diamonds and preci

Stone working – Sawing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

451405, 451450, 451 43, 451 44, 125 3001, B28D 102

Patent

active

056239165

ABSTRACT:
A device for holding and positioning stones that are being prepared for invisible set jewelry. The device includes an automatically cooled blade and a holding member for holding the stone wherein the position of the stone may be adjusted linearly and angularly about a plurality of orthogonal axes. A base is coupled to three orthogonal translation stages for linearly adjusting the location of the stone with respect to the blade. Further, the base is rotatably coupled to the linear translation stages thereby enabling the linear translation stages to rotate about a first axis of rotation which is orthogonal to the top planar surface of the base. A mounting arm is pivotally coupled to the linear translation stages about a second axis of rotation parallel to the planar surface of the base. The mounting arm includes stone holding means for securing the stone which is rotatable about a third axis of rotation transverse to the first and second axes and which provides linear adjustment to position the stone within the mounting arm. The mounting arm is further pivotable about a fourth axis of rotation orthogonal to the second axis of rotation. Finally, the mounting arm pivots about a fifth axis of rotation parallel to the first axis of rotation for raising and lowering the stone onto the cutting surface of the blade.

REFERENCES:
patent: 3897772 (1975-08-01), Averbuch
patent: 4292818 (1981-10-01), Vitau
patent: 4738240 (1988-04-01), Aich
patent: 5003678 (1991-04-01), Oganesyan
patent: 5033447 (1991-07-01), Schulze
patent: 5119599 (1992-06-01), Klipper et al.
patent: 5305506 (1994-04-01), Forman

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for cutting grooves into diamonds and preci does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for cutting grooves into diamonds and preci, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for cutting grooves into diamonds and preci will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-699570

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.