Method and apparatus for cutting diamond

Stone working – Sawing – Reciprocating

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125 1601, 125 21, B28D 100

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active

058904816

ABSTRACT:
A wire is used to cut or slice diamond by passing the wire rapidly and under light load over and into the diamond surface along a line to be cut. In one form of the invention, the wire comprises a metal that dissolves diamond, such as iron or nickel and the wire and/or diamond is preferably heated to approach the metal-carbon eutectic temperature and create sensible reaction rates of the carbon on the wire surface. In another form of the invention, the moving wire carries a molten oxidant to enhance the cutting rate. The molten oxidant may be, for example, sodium nitrate, which oxidizes carbon.

REFERENCES:
patent: 3954096 (1976-05-01), Barta et al.
patent: 5269283 (1993-12-01), Toyama et al.
patent: 5519938 (1996-05-01), Kojima et al.
S. Jin, et al., "Massive Thining Of Diamond Films By A Diffusion Process", Appl. Physics Letters, vol. 60, No. 16, Apr. 20, 1992.
S. Jin, et al., "Polishing Of CVD Diamond By Diffusional Reaction With Manganese Powder", Journal of Diamond and Related Materials, vol. 1, No. 9, Netherlands, Sep. 25, 1992.
Masanori Yoshikawa, "Development And Performance Of A Diamond Film Polishing Apparatus With Hot Metals", SPIE vol. 1325 Diamond Optics III, pp. 210-221, Japan, 1990.

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