Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal
Reexamination Certificate
2005-11-01
2005-11-01
Dang, Phuc T. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
C257S440000, C257S444000
Reexamination Certificate
active
06960813
ABSTRACT:
A method and system for cutting a wafer comprising a semiconductor substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer during and after cutting by vacuum pressure through the pores. The wafer is cut by directing UV pulses of laser energy at the substrate using a solid-state laser having controlled polarization. An adhesive membrane can be attached to the separated die to remove them from the mounting surface, or the die can otherwise be removed after cutting from the wafer.
REFERENCES:
patent: 3626141 (1971-12-01), Daly
patent: 3814895 (1974-06-01), Fredriksen
patent: 3816700 (1974-06-01), Weiner et al.
patent: 4237601 (1980-12-01), Woolhouse et al.
patent: 4336439 (1982-06-01), Sasnett et al.
patent: 4543464 (1985-09-01), Takeuchi
patent: 4562333 (1985-12-01), Taub et al.
patent: 4664739 (1987-05-01), Aurichio
patent: 4906011 (1990-03-01), Hiyamizu et al.
patent: 4921564 (1990-05-01), Moore
patent: 5057664 (1991-10-01), Johnson et al.
patent: RE33947 (1992-06-01), Shinohara
patent: 5138131 (1992-08-01), Nishikawa et al.
patent: 5324012 (1994-06-01), Aoyama et al.
patent: 5387776 (1995-02-01), Preiser
patent: 5611946 (1997-03-01), Leong et al.
patent: 5626777 (1997-05-01), Hugl et al.
patent: 5627109 (1997-05-01), Sassa et al.
patent: 5703713 (1997-12-01), Leong et al.
patent: 5801356 (1998-09-01), Richman
patent: 5809987 (1998-09-01), Wark et al.
patent: 5811751 (1998-09-01), Leong et al.
patent: 5961852 (1999-10-01), Rafla-Yuan et al.
patent: 5963364 (1999-10-01), Leong et al.
patent: 5987920 (1999-11-01), Bosman et al.
patent: 5994205 (1999-11-01), Yamamoto et al.
patent: 6057525 (2000-05-01), Chang et al.
patent: 6107162 (2000-08-01), Morita et al.
patent: 6121118 (2000-09-01), Jin et al.
patent: 6126520 (2000-10-01), Jochim-Schmidt et al.
patent: 6130401 (2000-10-01), Yoo et al.
patent: 6182733 (2001-02-01), McReynolds
patent: 6365429 (2002-04-01), Kneissl et al.
patent: 6413839 (2002-07-01), Brown et al.
patent: 6509546 (2003-01-01), Egitto et al.
patent: 6514339 (2003-02-01), Jung
patent: 2002/0031899 (2002-03-01), Manor
patent: 1137072 (2001-09-01), None
patent: 55151351 (1980-11-01), None
patent: 56006451 (1981-01-01), None
patent: 57066650 (1982-04-01), None
patent: 57081985 (1982-05-01), None
patent: 58044738 (1983-03-01), None
patent: 58044739 (1983-03-01), None
patent: 58068946 (1983-04-01), None
patent: 10064854 (1998-03-01), None
patent: 11224866 (1999-08-01), None
patent: 2000004066 (2000-01-01), None
patent: 2000196186 (2000-07-01), None
patent: 2001-170786 (2001-06-01), None
patent: WO 00/75983 (2000-12-01), None
Chen, Hung-Lung et al., “Laser Successfully Cuts Sapphire Substrate,” Optical Communication No. 93, Dec. 2001, pp. 37-40 (Chinese language document accompanied by English translation which consists of 9 pages.).
Guoan, Wu et al., “Laser Processes and Microelectronic Technology,” National Defense Industry Press, Beijing, China, Jul. 1997, 12 pages. (Chinese language document accompanied by English translation which consists of 12 pages.).
“Porous Tungsten & Molybdenum,” available at http://www.spectramat.com/pormotun.html.
Soilmoisture Equipment Corp., Catalog, available at http://www.soilmoisture.com/ceramics.html.
SOILMOISTURE, “Porous Ceramics Catalog,” available at http://www.soilmoisture.com.
Spectra-Physics Business Units: Products “Navigator II” (Oct. 7, 2002), 2 pages, see http://www.splasers.com/products/oem_products/fcb_yhb_series.html.
Spectra-Physics: Products “Navigator I” (Oct. 7, 2002), 2 pages, see http://www.splasers.com/products/oem_Products
avigator1.html.
Furukawa Electric, “What is UV-Tapes?” (May 23, 2002), 2 pages, see http://www.furukawa.co.jp/uvtape/en/whatis.htm.
Furukawa Electric product brochure, “UV-Tapes for Semiconductor Processing,” 8 pages.
Ostendorf, A., et al., “Material Processing Applications for Diode Pumped Solid State Lasers,” Lambda Highlights 57, Lambda Physik Pub. (May 2000), 8 pages.
Villeneuve, Tim, “Nanosecond pulsed lasers improve micro-machining,” ESIGNNEWS Semiconductor Manufacturing (Jun. 04, 2001) 33-35.
Dang Phuc T.
Haynes Beffel & Wolfeld LLP
New Wave Research
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