Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2006-05-30
2006-05-30
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C438S484000, C438S960000
Reexamination Certificate
active
07052976
ABSTRACT:
A method and system for cutting a wafer comprising a conductive substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer during and after cutting by vacuum pressure through the pores. The wafer is cut by directing UV pulses of laser energy at the conductive substrate using a solid-state laser. An adhesive membrane can be attached to the separated die to remove them from the mounting surface, or the die can otherwise be removed after cutting from the wafer.
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Dang Phuc T.
Haynes Mark A.
Haynes Beffel & Wolfeld LLP
New Wave Research
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