Method and apparatus for cutting and cleaning wafers in a...

Details Method and apparatus for cutting and cleaning wafers in a... Method and apparatus for cutting and cleaning wafers in a...

2009-01-13

2011-11-29

Nguyen, George (Department: 3723)

Stone working

Sawing

Endless

C125S016010, C125S016020, C083S651100

Reexamination Certificate

active

08065995

ABSTRACT:
A method and apparatus of cutting and cleaning wafers in a wire saw is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a first top outlet and a second top outlet located in a top position with respect to a work piece for applying fluids during sawing, and at least one chute located substantially below the work piece for receiving the fluids, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluids flow in a vertical direction against and into the work piece for slicing and cleaning wafers.

REFERENCES:
patent: 2851764 (1958-09-01), White
patent: 2967381 (1961-01-01), Brown
patent: 3081586 (1963-03-01), Gersbach
patent: 5771876 (1998-06-01), Egglhuber
patent: 5890481 (1999-04-01), Bigelow
patent: 5922137 (1999-07-01), Fukunaga et al.
patent: 5944007 (1999-08-01), Miyoshi et al.
patent: 5950643 (1999-09-01), Miyazaki et al.
patent: 6018884 (2000-02-01), Fukunaga et al.
patent: 6056031 (2000-05-01), Banzawa et al.
patent: 6182729 (2001-02-01), Banzawa et al.
patent: 6328027 (2001-12-01), Persyk et al.
patent: 6463920 (2002-10-01), Kondo et al.
patent: 6543434 (2003-04-01), Holzmuller et al.
patent: 6652356 (2003-11-01), Ariga
patent: 6920871 (2005-07-01), Bieri
patent: 6941940 (2005-09-01), Zavattari et al.
patent: 7025054 (2006-04-01), Kondo et al.
patent: 7025665 (2006-04-01), Bender
patent: 7306508 (2007-12-01), Kawasaki et al.
patent: 7503831 (2009-03-01), Radkevich et al.
patent: 7878883 (2011-02-01), Gupta et al.
patent: 2002/0115390 (2002-08-01), Kondo et al.
patent: 2002/0174861 (2002-11-01), Lundt et al.
patent: 2004/0084042 (2004-05-01), McAulay et al.
patent: 2008/0295860 (2008-12-01), Burger
patent: 2009/0223539 (2009-09-01), Gibbel
patent: 2010/0126489 (2010-05-01), Bakshi et al.
patent: 2010/0126490 (2010-05-01), Bakshi et al.

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