Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
Reexamination Certificate
2007-05-24
2010-11-09
Goff, John L (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With means applying wave energy or electrical energy...
Reexamination Certificate
active
07828030
ABSTRACT:
An apparatus for bonding disc substrates is provided with a spinner which spreads adhesive placed between a first substrate and second substrate, and a curing device which radiates ultraviolet light onto the adhesive through the substrate to cure it. The curing device includes; a support mechanism which supports the first substrate and second substrate after the adhesive is spread by the spinner, a semiconductor light emitting apparatus having a plurality of light emitting semiconductor elements arranged facing a region where the adhesive is cured, and a positioning mechanism which positions the semiconductor light emitting apparatus such that the light emitting semiconductor elements are a predetermined distance away from the adhesive. The adhesive is cured or semi-cured by ultraviolet light emitted from the plurality of light emitting semiconductor elements.
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English language translation of Japanese Office Action issued in connection with Japanese Patent Application No. 2003-188734, Sep. 5, 2006.
Machine English language translation of JP 10334521, Feb. 21, 2007.
Kobayashi Hideo
Nishimura Hironobu
Shinohara Shinichi
Utsunomiya Yukio
Goff John L
Kolisch Hartwell PC
Origin Electric Company Limited
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