Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1996-12-31
1999-04-20
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257705, 257796, 257712, 257778, H01L 2310, H01L 2334, H01L 2306
Patent
active
058959726
ABSTRACT:
An apparatus and method that permits the removal of heat from the back side surface of an integrated circuit semiconductor substrate while performing optical based testing through or at the back side surface of the semiconductor substrate.
In one embodiment, the present invention includes a semiconductor device having an infrared transparent heat slug attached to the back side surface of the device. Heat is removed from the semiconductor device through an infrared transparent heat slug that is then thermally cooled by a conventional cooling technique.
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Clark Jhihan B.
Intel Corporation
Saadat Mahshid
LandOfFree
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