Method and apparatus for cooling semiconductor chips

Details Method and apparatus for cooling semiconductor chips Method and apparatus for cooling semiconductor chips

2006-03-07

2008-08-19

Jones, Melvin (Department: 3744)

Refrigeration

Structural installation

With electrical component cooling

C062S515000

Reexamination Certificate

active

07412844

ABSTRACT:
A cooling apparatus for cooling a heat-generating chip mounted in a socket on a circuit board, the socket including a cradle having a standard heat-sink receiving configuration, includes an evaporator having a thermally conductive front face, a compressor in fluid communication with the evaporator for delivering refrigerant thereto, and an evaporator mount for coupling the evaporator to the heat-generating chip with the front face adjacent thereto. The mount includes a housing having coupling elements for connection to the cradle. The housing has an interior in which a housing insulation pack is provided for retaining the evaporator therein. The mount further includes a cradle insulation pack for maintaining the socket in moisture-free condition.

REFERENCES:
patent: 5323847 (1994-06-01), Koizumi et al.
patent: 5345107 (1994-09-01), Daikoku et al.
patent: 5539155 (1996-07-01), Kunieda et al.
patent: 5574627 (1996-11-01), Porter
patent: 6205796 (2001-03-01), Chu et al.
patent: 6679315 (2004-01-01), Cosley et al.
patent: 6687125 (2004-02-01), Park et al.
patent: 2004/0104468 (2004-06-01), Suzuki et al.
patent: 0 489 326 (1992-06-01), None
patent: 2005-093969 (2005-04-01), None
patent: WO 01/25881 (2001-04-01), None
patent: 03010646 (2003-02-01), None
patent: WO 2005/045654 (2005-05-01), None
Internet advertising. “Vapochill”. Retrieved Feb. 2006, from http://www.asetek.com.

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