Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-04-15
1998-03-10
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
257707, 257722, 361705, H05K 334
Patent
active
057247293
ABSTRACT:
The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.
REFERENCES:
patent: 4092697 (1978-05-01), Spaight
patent: 4233645 (1980-11-01), Balderes et al.
patent: 4654966 (1987-04-01), Kohara et al.
patent: 4718163 (1988-01-01), Berland et al.
patent: 4724611 (1988-02-01), Hagihara
patent: 4756081 (1988-07-01), Penn
patent: 4849856 (1989-07-01), Funari et al.
patent: 4853828 (1989-08-01), Penn
patent: 4939570 (1990-07-01), Bickford et al.
patent: 4999699 (1991-03-01), Christie et al.
patent: 5023695 (1991-06-01), Umezawa et al.
patent: 5109317 (1992-04-01), Miyamoto et al.
patent: 5249101 (1993-09-01), Frey et al.
patent: 5276586 (1994-01-01), Hatsuda et al.
patent: 5291064 (1994-03-01), Kurokawa
patent: 5325265 (1994-06-01), Turlik et al.
patent: 5604978 (1997-02-01), Sherif et al.
Reasearch Disclosure, No. 270, Publication No. 27014, Oct. 1986, "Stick-On Heat Sink".
Research Disclosure, No. 312, Publication No. 31293, Apr. 1990, "Controlled Collapse Thermal Joint Between Chip and Heat Sink".
Research Disclosure, No. 322, Publication No. 32262, Feb. 1991, "TCM Thermal Reticle".
Research Disclosure, No. 323, Publication No. 32364, Mar. 1991, "Clog-Resistant Jet Impingement Flow Balancing Device".
Research Disclosure, No. 326, Publication No. 32677, Jun. 1991, "TCM Hat Customization".
Technical Disclosure Bulletin, vol. 21, No. 2, Jul. 1978, "Conduction Cooling".
Technical Disclosure Bulletin, vol. 31, No. 12, May 1989, "Circuit Module Cooling with Multiple Pistons Contacting a Heat Spreader/Electrical Buffer Plate in Contact with Chip".
Technical Disclosure Bulletin, vol. 32, No. 8A, Jan. 1990, "Buffered Immersion Cooling with Buckling Bellows Providing Barrier Between Chip and System Coolant and Pressure".
Technical Disclosure Bulletin, vol. 33, No. 1A, Jun. 1990, "Fault-Tolerant Immersion Cooling".
Courtney Mark Gerard
Edwards David Linn
Fahey Albert Joseph
Hopper Gregory Scott
Iruvanti Sushumna
Ahsan Aziz M.
Arbes Carl J.
International Business Machines - Corporation
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