Method and apparatus for cooling electronic equipment within...

Refrigeration – Vortex tube – e.g. – ranque

Reexamination Certificate

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C062S259200

Reexamination Certificate

active

06990817

ABSTRACT:
A system for cooling electronic assemblies includes an equipment enclosure configured to receive a plurality of electronic assemblies in a plurality of mounting locations. The system also includes a cooling manifold that is mounted to the equipment enclosure and positioned to distribute chilled air to each of the electronic assemblies through a plurality of orifices.

REFERENCES:
patent: 3165147 (1965-01-01), Lewis
patent: 3654768 (1972-04-01), Inglis et al.
patent: 5010736 (1991-04-01), York et al.
patent: 5823005 (1998-10-01), Alexander et al.
patent: 6401463 (2002-06-01), Dukhan et al.
patent: 6628520 (2003-09-01), Patel et al.
“Packaged Systems Complete System Enclosure Packages”; Bently Nevada Corporation; 2001.

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