Method and apparatus for cooling electronic components

Details Method and apparatus for cooling electronic components Method and apparatus for cooling electronic components

2006-03-14

2006-03-14

Duong, Tho (Department: 3743)

Heat exchange

With retainer for removable article

Electrical component

C165S292000, C165S104330, C361S698000, C361S702000

Reexamination Certificate

active

07011143

ABSTRACT:
A modular fluid unit for cooling heat sources located on a rack, the modular fluid unit comprising: a heat exchanger in fluid communication a pump; and wherein the modular fluid unit is mountable within the rack and is configurable to be in fluid communication with a cold plate return manifold, a cold plate supply manifold, and an end-user fluid supply. A method for cooling electronic components in a rack, the method comprising: circulating a first liquid from a cold plate to one of a plurality of heat exchangers mounted within the rack; circulating a second liquid from a second liquid supply to the one of a plurality of heat exchangers; and transferring heat from the first liquid to the second liquid at the one of a plurality of heat exchangers.

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