Method and apparatus for cooling an integrated circuit chip duri

Details Method and apparatus for cooling an integrated circuit chip duri Method and apparatus for cooling an integrated circuit chip duri

1989-02-06

1991-01-01

Eisenzopf, Reinhard J.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324158P, 324158R, 279 3, G01R 100, G01R 102

Patent

active

049821539

ABSTRACT:
A method and apparatus for testing integrated circuit devices includes a cooling chuck which is extensible within a bore in a cooling chuck body to a position in thermal contact with the integrated circuit device. The temperature of the cooling chuck is regulated by a fluid cooling system, which can be set to operate at a selected capacity to maintain the integrated circuit device at a desired temperature during testing.

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patent: 4724222 (1988-02-01), Feldman
patent: 4757255 (1988-07-01), Margozzi
"Liquid Cooling of a Multichip Module Package", by Balderes et al., IBM Tech. Dicsl. Bull., vol. 20, No. 11A, 4/78, pp. 4336-4337.

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