Method and apparatus for cooling an integrated circuit...

Details Method and apparatus for cooling an integrated circuit... Method and apparatus for cooling an integrated circuit...

2006-04-25

2006-04-25

Ali, Mohammad M. (Department: 3744)

Refrigeration

Processes

Assembling, charging, or repairing of refrigeration producer

C062S259200

Reexamination Certificate

active

07032392

ABSTRACT:
A method and apparatus for cooling an integrated circuit die. An integrated circuit package comprises an integrated circuit die. A cooling fluid makes contact with the integrated circuit die. In one embodiment, an interposer is disposed between the integrated circuit die and a package substrate. The integrated circuit die and/or the interposer may have microchannels in its surface.

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