Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-03-11
2008-03-11
Gandhi, Jayprakash (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S696000, C361S699000, C361S721000, C165S080300, C165S080400, C165S080500, C165S104190, C165S104330
Reexamination Certificate
active
11427384
ABSTRACT:
A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
REFERENCES:
patent: 3749981 (1973-07-01), Koltuniak et al.
patent: 5144531 (1992-09-01), Go et al.
patent: 6305180 (2001-10-01), Miller et al.
patent: 6462949 (2002-10-01), Parish, IV et al.
patent: 6506111 (2003-01-01), Sharp et al.
patent: 6580609 (2003-06-01), Pautsch
patent: 6621707 (2003-09-01), Ishimine et al.
patent: 6628520 (2003-09-01), Patel et al.
patent: 6646879 (2003-11-01), Pautsch
patent: 6775137 (2004-08-01), Chu et al.
patent: 6819563 (2004-11-01), Chu et al.
patent: 2004/0221604 (2004-11-01), Ota et al.
patent: 2006/0102322 (2006-05-01), Madara et al.
Chu, et al., “System Cooling Design Considerations for Large Mainframe Computers”,National Science Foundation, pp. 365-387, 1991.
Chu, et al., “Review of Cooling Technologies for Computer Products”,IEEE Transactions on Device and Materials Reliability, vol. 4, No. 4, Dec. 2004.
Colgan, et al., “A Practical Implementation of Silicon Microchannel Coolers for High Power Chips”, 21stIEEE SEMI-THERM Symposium, 2005; and.
Crippen, et al., “BladeCenter Packaging, Power and Cooling”,IBM J. Res&Dev., Vo. 49, No. 6, pp. 887-904, Nov. 2005.
Colgan Evan G.
Coteus Paul W.
Guernsey, Jr. Robert W.
Hall Shawn A.
Karidis John P.
Gandhi Jayprakash
Hoffberg Robert J
Morris, Esq. Daniel P.
LandOfFree
Method and apparatus for cooling an equipment enclosure... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for cooling an equipment enclosure..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for cooling an equipment enclosure... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3906088