Method and apparatus for cooling a modular computer system...

Details Method and apparatus for cooling a modular computer system... Method and apparatus for cooling a modular computer system...

2005-10-25

2005-10-25

Chang, Yean-Hsi (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S690000, C165S080100, C174S015100

Reexamination Certificate

active

06958906

ABSTRACT:
A computer system and a method for cooling the system incorporate removable modules within a housing. The housing includes a parallelepiped structure with at least four walls. The four walls include at least two sets of opposing walls. Both walls of one set of opposing walls include opposing first and second openings substantially aligned with each other to allow passage of a cooling medium therethough. The module is receivable through a third opening in the parallelepiped structure and includes an electrical component region. The housing includes a first airflow path in-line with the third opening and a second airflow path between the first opening and the second opening. The first airflow path and the second airflow path are directed across the component region of the module when the module is received within the housing.

REFERENCES:
patent: 5173819 (1992-12-01), Takahashi et al.
patent: 5218514 (1993-06-01), Huynh et al.
patent: 5430607 (1995-07-01), Smith
patent: 5546272 (1996-08-01), Moss et al.
patent: 5572403 (1996-11-01), Mills
patent: 6058011 (2000-05-01), Hardt et al.
patent: 6129429 (2000-10-01), Hardt et al.
patent: 6271604 (2001-08-01), Frank, Jr. et al.
patent: 6297955 (2001-10-01), Frank, Jr. et al.
patent: 6359779 (2002-03-01), Frank, Jr. et al.
patent: 6389499 (2002-05-01), Frank, Jr. et al.
patent: 6411522 (2002-06-01), Frank, Jr. et al.
patent: 6437980 (2002-08-01), Casebolt
patent: 6468150 (2002-10-01), Langdon et al.
patent: 6496366 (2002-12-01), Coglitore et al.
patent: 6525935 (2003-02-01), Casebolt
patent: 6535384 (2003-03-01), Huang
patent: 6819560 (2004-11-01), Konshak et al.
patent: 2002/0015287 (2002-02-01), Shao
patent: 2002/0105786 (2002-08-01), Della Fiora et al.
patent: 2003/0016515 (2003-01-01), Jackson et al.
patent: 2003/0030975 (2003-02-01), Bestwick et al.
patent: 2003/0030976 (2003-02-01), Garnett et al.
patent: 2003/0030977 (2003-02-01), Garnett et al.
patent: 2003/0030978 (2003-02-01), Garnett et al.
patent: 2003/0031189 (2003-02-01), Larson et al.
patent: 2003/0033366 (2003-02-01), Garnett et al.
patent: 2003/0033460 (2003-02-01), King et al.
patent: 2003/0042003 (2003-03-01), Novotny et al.
patent: 2003/0042004 (2003-03-01), Novotny et al.

Affiliated with

Also associated with

Rating

Method and apparatus for cooling a modular computer system... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for cooling a modular computer system..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for cooling a modular computer system... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3480064