Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-08-31
1996-11-19
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 165908, 257721, H05K 720
Patent
active
055769322
ABSTRACT:
A method of cooling a heat source, such as an integrated circuit device, includes the following steps (1) providing a base having a plurality of elongated fins on a first side thereof and a mating surface on a second side thereof, with the plurality of elongated fins defining a plurality of channels, (2) positioning the mating surface of the base in contact with the integrated circuit device, (3) advancing a first flow of fluid onto a top surface of each of the plurality of fins so as to form a quantity of spent fluid which continues to be advanced into the plurality of channels, and (4) advancing a second flow of fluid into the plurality of channels so as to exhaust the quantity of spent fluid from the plurality of channels. An apparatus for cooling a heat source is also disclosed.
REFERENCES:
patent: 4399484 (1983-08-01), Mayer
patent: 4686606 (1987-08-01), Yamada et al.
patent: 4750086 (1988-06-01), Mittal
patent: 4783721 (1988-11-01), Yamamoto et al.
patent: 4882654 (1989-11-01), Nelson et al.
patent: 4897762 (1990-01-01), Daikoku et al.
patent: 4936380 (1990-06-01), Niggemann
patent: 5005640 (1991-04-01), Lapinski et al.
patent: 5023695 (1991-06-01), Umezawa et al.
patent: 5025856 (1991-06-01), VanDyke et al.
patent: 5028989 (1991-07-01), Naganuma et al.
patent: 5054545 (1991-10-01), Ghaemian
patent: 5103374 (1992-04-01), Azar
patent: 5239200 (1993-08-01), Messina et al.
patent: 5239443 (1993-08-01), Fahey et al.
patent: 5264984 (1993-11-01), Akamatsu
patent: 5265670 (1993-11-01), Zingher
patent: 5270572 (1993-12-01), Nakajima et al.
patent: 5294830 (1994-03-01), Young et al.
patent: 5365400 (1994-11-01), Ashiwake et al.
Bishop Eugene H.
Failla Gregory A.
Figliola Richard S.
Liburdy James A.
AT&T Global Information Solutions Company
Maginot Paul J.
Thompson Gregory D.
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