Method and apparatus for cooling a circuit component

Details Method and apparatus for cooling a circuit component Method and apparatus for cooling a circuit component

2006-05-16

2006-05-16

Thompson, Gregory D. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S121000, C165S185000, C257S722000, C361S703000

Reexamination Certificate

active

07046515

ABSTRACT:
An apparatus includes a thermally conductive section with a side facing approximately parallel to an axis and adapted to be thermally coupled to a circuit component, and includes a fluid supply section which directs a fluid flow along the axis toward an opposite side of the thermally conductive section. The thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.

REFERENCES:
patent: 4682651 (1987-07-01), Gabuzda
patent: 4715438 (1987-12-01), Gabuzda
patent: 4753290 (1988-06-01), Gabuzda
patent: 5005640 (1991-04-01), Lapinski et al.
patent: 5365400 (1994-11-01), Ashiwake et al.
patent: 5494098 (1996-02-01), Morosas
patent: 5504650 (1996-04-01), Katsui et al.
patent: 5581443 (1996-12-01), Nakamura et al.
patent: 5582240 (1996-12-01), Widmayer
patent: 5583746 (1996-12-01), Wang
patent: 5694294 (1997-12-01), Ohashi et al.
patent: 5731952 (1998-03-01), Ohgami et al.
patent: 5794685 (1998-08-01), Dean
patent: 5816319 (1998-10-01), Kamekawa et al.
patent: 5828551 (1998-10-01), Hoshino
patent: 5896917 (1999-04-01), Lemont et al.
patent: 6021844 (2000-02-01), Batchelder
patent: 6125920 (2000-10-01), Herbert
patent: 6135200 (2000-10-01), Okochi et al.
patent: 6373700 (2002-04-01), Wang
patent: 6411508 (2002-06-01), Kang et al.
patent: 6418020 (2002-07-01), Lin
patent: 6577502 (2003-06-01), DiStefano et al.
patent: 0860 874 (1997-12-01), None
International Search Report mailed Apr. 26, 2004 re International application No. PCT/US03/17952, filed Jun. 5, 2003.
U.S. Appl. No. 10/094,176, filed Mar. 8, 2002, entitled “Method and Apparatus for Removing Heat from a Plate”, 21 pages of text and 3 pages of drawings.
U.S. Appl. No. 10/164,522, filed Jun. 6, 2002, entitled “Method and Apparatus for Cooling A Portable Computer”, 32 pages of text and 6 pages of drawings.

Affiliated with

Also associated with

Rating

Method and apparatus for cooling a circuit component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for cooling a circuit component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for cooling a circuit component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3546492