Method and apparatus for controlling vessel characteristics,...

Details Method and apparatus for controlling vessel characteristics,... Method and apparatus for controlling vessel characteristics,...

2007-07-12

2010-12-28

Wilkins, III, Harry D (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Controlling current distribution within bath

C205S157000, C205S640000

Reexamination Certificate

active

07857958

ABSTRACT:
A method and apparatus for processing a microfeature workpiece. In one embodiment, the apparatus includes a support member configured to carry a microfeature workpiece at a workpiece plane, and a vessel positioned at least proximate to the support member. The vessel has a vessel surface facing toward the support member and positioned to carry a processing liquid. The vessel surface is shaped to provide an at least approximately uniform current density at the workpiece plane. At least one electrode, such as a thieving electrode, is disposed within the vessel. In a further aspect of this embodiment, the thieving electrode can be easily removable along with conductive material it attracts from the processing liquid. The shape of the vessel surface, the current supplied to the thieving electrode and/or the diameter of an aperture upstream of the workpiece are changed dynamically in other embodiments.

REFERENCES:
patent: 1526644 (1925-02-01), Pinney
patent: 1881713 (1932-10-01), Laukel
patent: 3616284 (1971-10-01), Bodmer et al.
patent: 4046105 (1977-09-01), Gomez
patent: 4170959 (1979-10-01), Aigo
patent: 4304641 (1981-12-01), Grandia
patent: 4323433 (1982-04-01), Loch
patent: 4378283 (1983-03-01), Seyffert
patent: 4391694 (1983-07-01), Runsten
patent: 4466864 (1984-08-01), Bacon
patent: 4634503 (1987-01-01), Nogavich
patent: 4906341 (1990-03-01), Yamakawa
patent: 5000827 (1991-03-01), Schuster
patent: 5078852 (1992-01-01), Yee
patent: 5090432 (1992-02-01), Bran
patent: 5135636 (1992-08-01), Yee et al.
patent: 5156730 (1992-10-01), Bhatt et al.
patent: 5168887 (1992-12-01), Thompson
patent: 5217586 (1993-06-01), Datta et al.
patent: 5228966 (1993-07-01), Murata
patent: 5256274 (1993-10-01), Poris
patent: 5344491 (1994-09-01), Katou
patent: 5368711 (1994-11-01), Poris
patent: 5376176 (1994-12-01), Kuriyama
patent: 5391285 (1995-02-01), Lytle et al.
patent: 5429733 (1995-07-01), Ishida
patent: 5437777 (1995-08-01), Kishi
patent: 5443707 (1995-08-01), Mori
patent: 5662788 (1997-09-01), Sandhu et al.
patent: 5670034 (1997-09-01), Lowery
patent: 5681392 (1997-10-01), Swain
patent: 5723028 (1998-03-01), Poris
patent: 6027631 (2000-02-01), Broadbent
patent: 6074544 (2000-06-01), Reid et al.
patent: 6080691 (2000-06-01), Lindsay et al.
patent: 6090260 (2000-07-01), Inoue et al.
patent: 6099702 (2000-08-01), Reid
patent: 6099712 (2000-08-01), Ritzdorf
patent: 6103096 (2000-08-01), Datta et al.
patent: 6110346 (2000-08-01), Reid et al.
patent: 6156167 (2000-12-01), Patton et al.
patent: 6159354 (2000-12-01), Contolini et al.
patent: 6162344 (2000-12-01), Reid et al.
patent: 6174425 (2001-01-01), Simpson et al.
patent: 6179983 (2001-01-01), Reid et al.
patent: 6193859 (2001-02-01), Contolini et al.
patent: 6228232 (2001-05-01), Woodruff et al.
patent: 6258220 (2001-07-01), Dordi et al.
patent: 6261433 (2001-07-01), Landau
patent: 6270647 (2001-08-01), Graham et al.
patent: 6391166 (2002-05-01), Wang
patent: 6402923 (2002-06-01), Mayer
patent: 6444101 (2002-09-01), Stevens
patent: 6466864 (2002-10-01), Stefan et al.
patent: 6491806 (2002-12-01), Dubin
patent: 6565729 (2003-05-01), Chen
patent: 6599412 (2003-07-01), Graham
patent: 6755954 (2004-06-01), Mayer et al.
patent: 6773571 (2004-08-01), Mayer et al.
patent: 6828654 (2004-12-01), Tam et al.
patent: 2002/0046952 (2002-04-01), Graham et al.
patent: 2002/0163487 (2002-11-01), Sudo et al.
patent: 2002/0195352 (2002-12-01), Mayer et al.
patent: 2003/0038035 (2003-02-01), Wilson
patent: 0290210 (1988-11-01), None
patent: WO-99/16936 (1996-04-01), None
patent: WO-00/61498 (2000-10-01), None
patent: WO-00/61837 (2000-10-01), None
Lee, Tien-Yu Tom et al., “Applicaiton of a CFD Tool in Designing a Fountain Plating Cell for Uniform Bump Plating of Semiconductor Wafers,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Feb. 1996, pp. 131-137, vol. 19, No. 1.
Lowenheim, F. A. “Electroplating,” Jan. 22, 1979, 12 pgs, McGraw-Hill Book Company, New York.

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