Heat exchange – With retainer for removable article – Including liquid heat exchange medium
Patent
1984-05-02
1985-08-20
Richter, Sheldon J.
Heat exchange
With retainer for removable article
Including liquid heat exchange medium
51235, 118730, 118733, 118 50, 165 86, 165185, 2504923, 269 21, 269903, F28F 900
Patent
active
045358346
ABSTRACT:
Apparatus for providing thermal transfer between a semiconductor wafer and a heat sink or source in a vacuum processing chamber includes a platen against which the wafer is sealed to define a thermal transfer region therebetween. The platen includes a passage for gas flow between the chamber and the thermal transfer region. The apparatus further includes a valve for controllably opening and closing the passage and a controller for closing the valve when the pressure in the chamber reaches a predetermined value. Gas at the predetermined pressure, typically 0.5 to 100 Torr, is trapped in the thermal transfer region and conducts thermal energy between the workpiece and the platen. In a preferred embodiment, a plurality of platens are positioned on a rotating disc in an ion implantation system and a centrifugally operated valve is utilized to close the passage.
REFERENCES:
patent: 3566960 (1969-08-01), Stuart
patent: 4139051 (1979-02-01), Jones et al.
patent: 4261762 (1981-04-01), King
patent: 4282924 (1981-08-01), Faretra
patent: 4453080 (1984-06-01), Berkowitz
patent: 4457359 (1984-07-01), Holden
patent: 4458746 (1984-07-01), Holden et al.
patent: 4491173 (1985-01-01), Demand
King et al., "Experiments on Gas Cooling of Wafers," Nucl. Instrum. Methods, 189 (1981) pp. 169-173.
Hammer, "Cooling Ion Implantation Target," IBM Technical Disclosure Bulletin, vol. 19, No. 6, Nov. 1976, pp. 2270-2271.
Mack, "Wafer Cooling in Ion Implantation," Ion Implantation: Equipment and Techniques, Proc. Fourth Int. Conf., Sep. 1982, (Springer-Verlag, 1983), pp. 221-233.
Model 80-10 High Current Ion Implantation System Brochure, Varian/Extrion Division, Feb. 1982.
Cole Stanley Z.
McClellan William R.
Richter Sheldon J.
Varian Associates Inc.
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