Method and apparatus for controlling flatness of polished semico

Details Method and apparatus for controlling flatness of polished semico Method and apparatus for controlling flatness of polished semico

1996-08-09

1998-08-04

Fulton, Christopher W.

Geometrical instruments

Gauge

Straightness, flatness, or alignment

33551, 33553, G01B 520

Patent

active

057875952

ABSTRACT:
Apparatus for determining the flatness of a generally circular polishing pad through direct measurement of the pad for use in maintaining the flatness of the pad and the flatness of surfaces of articles polished on the polishing pad of a polisher. The apparatus includes a measuring device, a frame mounting the measuring device being capable of measuring a distance between an upper surface of the polishing pad and a reference plane at plural locations along the polishing pad. The apparatus further includes a controller for controlling the measuring device. The controller is configured to indicate whether the flatness of the pad falls outside a predetermined specification.

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"Ultra High Accuracy Laser Displacement Meter, LC-2400A Series," Keyence Corporation of America, pp. 1-4, 1994.
"Technology Overview, Magne Rule Plus," Lucas, pp. 4, 8-9, (undated) (admitted prior art).
"Group 2 Systems, 2CB Superslide.TM., Twin Shaft Web System," pp. 67-68, undated (admitted prior art).

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