Method and apparatus for controlling backside pressure during ch

Details Method and apparatus for controlling backside pressure during ch Method and apparatus for controlling backside pressure during ch

1998-08-19

1999-07-20

Breneman, R. Bruce

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

156345, H01L 2100

Patent

active

059255765

ABSTRACT:
A plug for plugging selected perforations in a carrier assembly used in a chemical mechanical polishing system for polishing semiconductor wafers is disclosed. The plug comprises a pressure-resistant portion; a bottom portion attached to the pressure-resistant portion; and a leak-resistant portion extending from the pressure-resistant portion, dimensioned to fit snugly into the bottom portion.

REFERENCES:
patent: 5635083 (1997-06-01), Breivogel et al.
patent: 5653622 (1997-08-01), Drill et al.
patent: 5791973 (1998-08-01), Nishio

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