Method and apparatus for controlling adhesive spreading when att

Details Method and apparatus for controlling adhesive spreading when att Method and apparatus for controlling adhesive spreading when att

1993-02-19

1995-04-25

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437214, 437215, 437217, 437219, 437220, H01L 2160

Patent

active

054098637

ABSTRACT:
An apparatus and method for controlling unwanted spread of adhesive used to attach a semiconductor integrated circuit die to an integrated circuit package assembly. A barrier prevents the adhesive from spreading onto bond finger connections of the integrated circuit package. The barrier may be a solder mask ring outside of and encircling the perimeter of the die attachment area of the package assembly. The barrier is located between the die attachment area and the adjacent bond fingers of the package.

REFERENCES:
patent: 4143456 (1979-03-01), Inoue
patent: 4647959 (1987-03-01), Smith
patent: 5041395 (1991-08-01), Steffen
patent: 5061990 (1991-10-01), Arakawa
patent: 5156983 (1992-10-01), Schlesinger et al.

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